Paste Printing Machine - List of Manufacturers, Suppliers, Companies and Products

Paste Printing Machine Product List

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[Case Study] Communication Device Manufacturer Company A

[Case Study] Communication Device Manufacturer Company A

Successful wafer bumping with a 180μm pitch! Established a mass production line using screen printing.

The development team at Company A was conducting evaluation experiments with several printing machine manufacturers in anticipation of mass production of a new communication device for mobile terminals, focusing on solder bumping through screen printing. However, they were not achieving satisfactory results. In response, we proposed the following by utilizing the filling pressure control feature of the press-fit squeegee unit equipped in our printing machine, the "TD-4420 Series": - "Proposing pressurization conditions that allow 100% solder paste filling within the mask opening." - "Recommending the use of high-viscosity solder paste, around 280 Pa·s, which cannot be handled by conventional printing machines, as a countermeasure against solder bridging." The issues that had been troublesome during evaluation experiments with other manufacturers' printing machines were resolved quite easily, allowing them to start mass production as planned without significantly revising the new product's production process. [Proposed Product] - Solder paste printing machine "TD-4420" - Squeegee unit - Wet cleaner *For more details, please refer to the PDF document or feel free to contact us.*

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Until the via filling of conductive paste! Solder paste printer TD-4420

Until the via filling of conductive paste! Solder paste printer TD-4420

High precision design with a printing accuracy of ±10μm enables narrow and narrow-pitch printing! By realizing 'hybrid squeegeeing,' we challenge the limits of screen printing.

The product "Solder Paste Printer TD-4420" is a printing machine that uses a paste press-in method and is equipped with a housing-type squeegee unit. (Examples of Use) - Formation of solder bumps on flip chip interposer substrates (bump pitch 150–200μm) - Formation of solder bumps on 6/8-inch wafers for printed devices (bump pitch 120–150μm) - Formation of solder bumps on 4-inch wafers for wireless communication devices (bump pitch 150–170μm) (Features of the Squeegee Unit) - The paste is stored in a cartridge with a structure that is shielded from the outside air, which helps prevent degradation such as oxidation. - The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. - The automatic replenishment and automatic stirring functions maintain a consistent amount and viscosity of the paste within the cartridge. - This printing method does not leave paste on the mask after squeegeeing, which can reduce paste loss. *For more details, please refer to the PDF document. Evaluation demos in a clean room (Class 10,000) are also possible. Please feel free to contact us.

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Technical Data: Solder Paste Printer

Technical Data: Solder Paste Printer

Publishing the printing results of bump printing and thick film printing! Clearly explained with illustrations.

This document introduces the "solder paste printing machine" handled by Tani Electric Industry. It includes features, as well as printing results for fine printing, bump printing, and thick film printing. The information is presented clearly along with illustrations, so please take a moment to read it. 【Contents (excerpt)】 ■Feature 1: Press-fit cassette squeegee ■Feature 2: Dry cleaner ■Feature 3: Backup plate separation ■Further fine printing: Squeegee ■Further fine printing: Others *For more details, please refer to the PDF document or feel free to contact us.

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Solder paste printer "TD-4420" & bumping service

Solder paste printer "TD-4420" & bumping service

Sales of solder paste printing machines compatible with narrow and fine pitch, with a printing accuracy of ±10μm, and contract services such as bumping!

The "Solder Paste Printer TD-4420" is a paste-insertion type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide suitable printing conditions for a wide range of printing needs. The realization of "hybrid squeegeeing," which combines contact printing and off-contact printing, challenges the limits of screen printing. The metal mask cleaner features both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main Equipment) - Solder Paste Printer 'TD-4420' - N2 Reflow Oven - Flux Cleaning Machine - Flattening Device - Bump Height Measuring Device - X-ray Observation Device (Main Solder Bumping Achievements) - Graphic Memory - Automotive Microcontrollers - Analog Devices - Data Storage Memory *For more details, please refer to the PDF document. Evaluation demos in the clean room (Class 10,000) are also available. Please feel free to contact us.

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Solder paste printer "TD-4420" & bumping service

Solder paste printer "TD-4420" & bumping service

A must-see for electronic device manufacturers! Sales of solder paste printing machines compatible with narrow and fine pitch, with a printing accuracy of ±10μm, and contract services such as bumping!

The "Solder Paste Printer TD-4420" is a paste insertion type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. The realization of "hybrid squeegeeing," which combines contact printing and off-contact printing, challenges the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main Equipment) - Solder Paste Printer "TD-4420" - N2 Reflow Oven - Flux Cleaning Machine - Flattening Device - Bump Height Measurement Device - X-ray Inspection Device (Main Solder Bumping Achievements) - Graphic Memory - Automotive Microcontrollers - Analog Devices - Data Storage Memory *For more details, please refer to the PDF document. Evaluation demos in the clean room (Class 10,000) are also available. Please feel free to contact us.

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